1Mb FLASH
RF Filter &
Matching
2.2uH
32MHz
DC-DC
DA14531
Vbat
VSS
GPIO
Reset
Bluetooth® low energy solution that will power
the next 1 billion IoT devices through ease of use.
DA14531 SMARTBOND
TINY™ MODULE
The DA14531 SmartBond TINY™ Module, based on the world’s smallest and lowest power Bluetooth 5.1 System-on-Chip, brings the DA14531
SoC advantages to an integrated module. It just requires a power supply and a printed circuit board to build a Bluetooth application.
The module is targeting broad market use and will be certied across regions providing signicant savings in development cost and time-to-
market. It comes with an integrated antenna and easy to use software making Bluetooth low energy development easier than ever before.
This awesome combination takes mobile connectivity to applications previously out of reach, enabling of the next billion IoT devices, with
SmartBond TINY™ at their core.
DA14531 SmartBond TINY™ Module Block Diagram
renesas.com
renesas.com
¡
Bluetooth 5.1 core qualied
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Integrated antenna
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Worldwide certication
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Cortex-M0+ @16MHz
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IoTMark™-BLE score of 18300
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23.75uA/MHz MCU current
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Memory: 48kB RAM, 32kB OTP &1Mb FLASH
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1.8-3.3V Supply Range
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+2.2dBM max output power
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-93dBm sensitivity
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Rx current 2mA at 3V
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Tx current 4mA at 3V at 0dBm
¡
Interfaces: 2xUART, SPI, I2C
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4-channel 10-bit ADC
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8 GPIO
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Built-in temperature sensor
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Operating temperature: -40°C to +85°C
¡
Dimensions: 12.5x14.5x2.8 mm
¡
Beacons, Remote controls, Proximity tags, Toys,
Low power sensors, Bluetooth LE add-on “pipe”
to existing applications
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Provisioning of any type of equipment providing
ease of use with smartphone APP-based based
setup and control, eliminating the need for
printed user manuals
Based on the DA14531 with a powerful 32-bit Arm Cortex-M0+,
integrated memories and a complete set of analog and digital
peripherals, SmartBond TINY™ module is extremely power
efcient. TheDA14531’s architecture and resources allow it to be
used as a standalone wireless microcontroller or as a Bluetooth
LE data pipe extension to designs with existing microcontrollers.
It is complemented by a exible Software Development Kit (SDK)
supporting major compilers such as Keil® and GCC out of the box.
For simple applications, the Renesas CodeLess software will
allow development without writing software code at all, using a
comprehensive set of AT commands and pushing the boundaries
of easeof use to the next level.
Key Features:
Applications
DA14531 SmartBond TINY™
renesas.com
SmartSnippets™ SDK
The DA14531 is delivered with our complete SmartSnippets™ Software
Development Kit including Renesas' mature and proven Bluetooth stack.
SDK features:
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Bluetooth 5.1 core features
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SUOTA for easy Software-Upgrade-Over-the-Air
¡
HCI/GTL/DSPS support to act as Bluetooth LE data pipe for an
externalMCU
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Security with software based TRNG
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CodeLess AT Command software
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Key proles like device information and battery service
¡
Software examples
SmartSnippets™ Studio
SmartSnippets™ Studio is a royalty-free software development platform
for Smartbond™ devices. It fully supports the DA14531 and DA1458x. The
compiler support for DA14531 is based on the free version from Keil® or
GCC.
SmartSnippets™ Toolbox
SmartSnippets™ Toolbox is provided with the Development Kit of
Renesas' Bluetooth chipset. It is targeting the main activities of
programming and optimizing code for best power performance.
Key features to the Toolbox are:
¡
Data rate monitoring
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Power proling for real-time access of power consumption
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Programmer of FLASH and OTP
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Interfacing to hardware for device conguration:
Power modes, radio setting etc.
Production Line Toolkit
The Production Line Toolkit enables customers to save cost by
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Accelerated production set up (fast track to production start)
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High throughput of less than 1 sec/device by running 16 devices
undertest in parallel
Key features:
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XTAL trimming
¡
RF testing
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SW programming
¡
Functional testing
Software and Hardware Tools
e
12.50 mm
14.50 mm
J2
J3
J4
J5
J6J7J8J9J10J11
J14
J13
J12
J1
J16
J15
J14
J13
J12
J2
J3
J4
J5
J1
b
L
Common Dimensions
Pin#1
Top view
Terminal view
Side view
2.80mm
2.00mm
0.80mm
8.90 mm
10.30 mm
DA14531
SmartBond TINY™
Module
J16
J15
e
12.50 mm
14.50 mm
J2
J3
J4
J5
J6J7J8J9J10J11
J14
J13
J12
J1
J16
J15
J14
J13
J12
J2
J3
J4
J5
J1
b
L
Common Dimensions
Pin#1
Top view
Terminal view
Side view
2.80mm
2.00mm
0.80mm
8.90 mm
10.30 mm
DA14531
SmartBond TINY™
Module
J16
J15
© 2023 Renesas Electronics America Inc. (REA). All rights reserved. All trademarks are the property of their respective owners. REA believes the information herein was accurate when given but assumes no risk as to its quality or use. All information is provided as-is without
warranties of any kind, whether express, implied, statutory, or arising from course of dealing, usage, or trade practice, including without limitation as to merchantability, tness for a particular purpose, or non-infringement. REA shall not be liable for any direct, indirect, special,
consequential, incidental, or other damages whatsoever, arising from use of or reliance on the information herein, if advised of the possibility of such damages. REA reserves the right, without notice, to discontinue products or make changes to the design or specications
of its products or other information herein. All contents are protected by U.S. and international copyright laws. Except as specically permitted herein, no portion of this material may be reproduced in any form, or by any means, without prior written permission from Renesas
Electronics America Inc. Visitors or users are not permitted to modify, distribute, publish, transmit or create derivative works of any of this material for any public or commercial purposes.
Renesas Electronics America Inc.
|
renesas.com
1001 Murphy Ranch Road, Milpitas, CA 95035
|
Phone: 1-888-468-3774
DA14531 SmartBond TINY™ Module
DA14531 Development Kits
Part number Size (mm) Shipment form Pack Quantity MOQ
DA14531MOD-00F01002 12.5 x 14.5 x 2.8 Reel 1000 1
DA14531MOD-00F0100C 12.5 x 14.5 x 2.8 Reel 100 3
Part number Description
DA14531MOD-00DEVKT-P Development Kit
isbased on module samples
Bluetooth Low Energy Development Kit Pro for DA14531 SmartBond TINY™ Module: Includes motherboard,
daughterboard and cables; Primary usage is SW application development and power measurements
DA14531MOD-00F1DB-P DA14531 Module Daughterboard for Pro Development Kit
For more information and
purchasing please visit:
www.renesas.com/DA14531mod
Side view
Top view
DA14531 SmartBond TINY™ Module Package
Ordering Information
DA14531 Module
Development Kit-Pro
